T. Vu Dinh

New skin-effect equivalent circuit36 trích dẫn
Electronics Letters · 1990 · DOI

A Silicon RFCMOS SOI Technology for Integrated Cellular/WLAN RF TX Modules31 trích dẫn
· 2007 · DOI

Time domain analysis of skin effect on lossy interconnections16 trích dẫn
Electronics Letters · 1990 · DOI

SPICE simulation of lossy and coupled interconnection lines9 trích dẫn
IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1994 · DOI

Attenuation, phase velocity and current density distribution in high critical temperature superconducting planar transmission lines5 trích dẫn
IEEE Transactions on Magnetics · 1995 · DOI

Optimizing Open Radio Access Network Systems with LLAMA V2 for Enhanced Mobile Broadband, Ultra-Reliable Low-Latency Communications, and Massive Machine-Type Communications: A Framework for Efficient Network Slicing and Real-Time Resource Allocation4 trích dẫn
Sensors · 2024 · DOI

Equivalent circuit modelling of lossy coupled lines using spice software2 trích dẫn
Electronics Letters · 1991 · DOI

Modelling the capacitance of microstrip line using spice1 trích dẫn
Electronics Letters · 1992 · DOI

Superconductive interconnections in multi-chip modules
IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 1993

Layout effects on the thermal metrics of multichannel FinFETs
Solid-State Electronics · 2025 · DOI