Van-Nhat Le

Nhà nghiên cứu Hồ sơ 5/10

8 công bố · 139 trích dẫn · h-index 3

Thông tin

🏛️Nơi công tác: Đại học Đà Nẵng
🔬Lĩnh vực: Điện tử
✍️Hồ sơ chưa đầy đủ — bổ sung thông tin

Công bố tiêu biểu

Depth of cut per abrasive in fixed diamond wire sawing67 trích dẫn
The International Journal of Advanced Manufacturing Technology · 2015 · DOI

Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module52 trích dẫn
International Journal of Solids and Structures · 2016 · DOI

A design of a new miniature device for solder joints’ mechanical properties evaluation21 trích dẫn
Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science · 2016 · DOI

Influence of Abrasive Density on the Material Removal Mechanisms in Diamond Wire Sawing of Silicon Crystal
Lecture notes in networks and systems · 2022 · DOI

Development of a Sintering System and Effect of Sintering Pressures on the Mechanical Properties and Microstructure of Silver-Sintered Joints for High-Power Applications
SSRN Electronic Journal · 2025 · DOI

Effect of Sintering Pressures and Sintering Layer Thickness on the Mechanical Properties and Microstructure of Silver-Sintered Joints for High-Power Applications
SSRN Electronic Journal · 2025 · DOI

Influence of sintering pressure and joint thickness on the mechanical and fracture behavior of silver-sintered joints
· 2025 · DOI

Micromechanical Model for Describing Intergranular Fatigue Cracking in an Innovative Solder Alloy
Lecture notes in civil engineering · 2017 · DOI

Về lĩnh vực Điện tử

1.159học giả

21.369công bố

246.448trích dẫn

4.6h-index trung bình

Hướng nghiên cứu phổ biến trong lĩnh vực:

Energy Harvesting in Wireless NetworksAntenna Design and AnalysisAdvanced MIMO Systems OptimizationAdvanced Wireless Communication TechnologiesEnergy Efficient Wireless Sensor NetworksAdvanced Wireless Communication Techniques

Nơi có nhiều học giả lĩnh vực này nhất: